Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 16, 2008
Patent Application Number
11585430
Date Filed
October 24, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
Electrically conductive preformed compositions comprising sulfur-containing polymers in shaped form and the use of preformed compositions in shaped form to seal apertures are disclosed. The preformed compositions can be used to seal an aperture having EMI/RFI shielding effectiveness.
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