Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 16, 2008
Patent Application Number
11084204
Date Filed
March 21, 2005
Patent Primary Examiner
Patent abstract
A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and forming through hole filling materials, comprising a zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and the balance of zinc and unavoidable impurities.
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