US Patent 7427059 Paper handling system materials exit path arrangement

A materials handling system includes an insertion subsystem for inserting materials into envelopes to form mailpieces of a first type and mailpieces of a second type. The materials handling syatem also includes a first mailpiece transport path located downstream from the insertion subsystem and having a curved portion along which mailpieces of said first type are transported, and a second mailpiece transport path being substantially horizontal, located downstream from the insertion subsystem, and along which mailpieces of the second type are transported. Further, a diverter is included that diverts mailpieces of the first type to the first transport path and mailpieces of the second type to the second transport path.