Patent attributes
A cooling arrangement with a housing for receiving electronic printed circuit boards or plug-in modules, and with an air-conditioning device which is connected via a coolant-conducting feed line and a return-flow line with at least one electronic component, to be cooled, on the respective printed circuit board or the plug-in module. The feed line is coupled with at least one component feed line assigned to the electronic component. The return-flow line is coupled with at least one component return-flow line assigned to the electronic component. The printed circuit board or the plug-in module has an area for fitting electronic components and a coupling area for coupling the feed line with the component feed line and for coupling the return-flow line with the component return-flow line.
