Patent attributes
A first power supply layer spreads over an insulating layer outside an island of a second power supply layer. A first ground layer spreads over an insulating layer outside an island of a second ground layer. First and second electrically-conductive pieces are interposed between the first and second power supply layers as well as between the first and second ground layers. A capacitor is interposed between the first and second electrically-conductive pieces. Power supply noise is forced to inevitably pass through the electrically-conductive pieces. The power supply noise thus reliably flows into the capacitor through the first and second electrically-conductive pieces. A printed wiring board is in this manner allowed to enjoy a sufficient suppression of the power supply noise.
