Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shuichi Tanaka0
Hiroki Kato0
Date of Patent
September 30, 2008
0Patent Application Number
113328780
Date Filed
January 13, 2006
0Patent Primary Examiner
Patent abstract
Provided is an electronic component including a pad provided on an active surface of a rectangular chip substrate, a resin protrusion provided along sides of the chip substrate, and a conductive portion which is electrically connected to the pad and which is formed out of a conductive film covering the surface of the resin protrusion. The resin protrusion includes a protruded body extending linearly and a plurality of the resin protrusions are provided on at least one side of the chip substrate to form a clearance in an intermediate portion of the side.
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