Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ming-Hsiang Cheng0
Date of Patent
September 30, 2008
0Patent Application Number
116162870
Date Filed
December 27, 2006
0Patent Primary Examiner
Patent abstract
An image sensor package includes a substrate, a lens module and a bottom cover. Herein the substrate has an upper surface and a lower surface, a plurality of passive components is fabricated on the lower surface and a chip is disposed on the upper surface. The lens module is mounted on the substrate and covers the chip. The bottom cover is connected to the lower surface of the substrate to enclose the passive components.
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