Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 30, 2008
Patent Application Number
11627237
Date Filed
January 25, 2007
Patent Primary Examiner
Patent abstract
A package structure is provided herein. The package structure includes a first substrate and a second substrate. A first seal ring having a first height is disposed around a predetermined area of the first substrate and between the first and second substrates. A second seal ring having a second height is disposed on the first substrate and around the first seal ring. A sealant is provided between the first and second seal rings to seal up the package structure.
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