Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wen-Tsai Su0
Chih-Chiang Chen0
Chin-Chi Shen0
Ming-Jer Chiu0
Date of Patent
September 30, 2008
0Patent Application Number
112362170
Date Filed
September 27, 2005
0Patent Primary Examiner
Patent abstract
Bond pad structures are presented. Some embodiments of the structure include a conductive conductor-insulator layer overlying a substrate. The conductive conductor-insulator layer includes a composite region having a conductor sub-region and insulator sub-region, which neighbor each other, and a single material region. The insulator is harder than the conductor.
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