Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 30, 2008
Patent Application Number
11172300
Date Filed
June 30, 2005
Patent Primary Examiner
Patent abstract
A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.
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