Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kyungmoo Lee0
Eunsang Ji0
Date of Patent
October 7, 2008
0Patent Application Number
117347740
Date Filed
April 12, 2007
0Patent Primary Examiner
Patent abstract
A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.
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