US Patent 7432592 Integrated micro-channels for 3D through silicon architectures
Patent 7432592 was granted and assigned to Intel on October, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 13, 2005
Date of Patent
October 7, 2008
Patent Application Number
11250644
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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