US Patent 7432601 Semiconductor package and fabrication process thereof
Patent 7432601 was granted and assigned to Powertech Technology on October, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 10, 2006
0
Date of Patent
October 7, 2008
0
Patent Application Number
11544934
0
Patent Inventor Names
Cheng-Pin Chen
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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