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Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 14, 2008
Patent Application Number
11113498
Date Filed
April 25, 2005
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer, wherein the bottom layer is substantially coextensive with the polishing layer, the polishing layer being joined to the bottom layer without the use of an adhesive; the polishing layer having an average surface roughness, Ra, that is greater than the Ra of the bottom layer.
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