Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 14, 2008
Patent Application Number
11256736
Date Filed
October 24, 2005
Patent Primary Examiner
Patent abstract
Provided are several polishing compositions useful for modifying a surface, such as a semiconductor wafer suitable for fabrication of a semiconductor device, especially when used in fixed abrasive planarization techniques. The polishing compositions include a synergistic mixture of water, an oxidizing agent, a complexing agent, and metal ions. Also provided are various methods of surface planarization.
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