Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ye Cheng Cheng0
Date of Patent
October 14, 2008
0Patent Application Number
113367850
Date Filed
January 23, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A tape substrate having hole(s) formed discontinuously along a bent portion thereof and configured to dissipate stress applied to the bent portion. A tape package using the tape substrate may be connected to a panel and a printed circuit board using an ACF. The tape package may be bent and located behind at least one side of the panel.
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