US Patent 7436048 Multichip leadframe package
Patent 7436048 was granted and assigned to Chippac on October, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 14, 2007
0
Date of Patent
October 14, 2008
0
Patent Application Number
11686010
0
Patent Inventor Names
Taebok Jung
0
Jongwoo Ha
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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