Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Krista J. Whittenburg0
Carl L. Deppisch0
Fay Hua0
Date of Patent
October 14, 2008
0Patent Application Number
101417350
Date Filed
May 9, 2002
0Patent Primary Examiner
Patent abstract
Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.
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