Patent attributes
A wafer transfer system, and method of controlling pressure in the system, includes a loadport for receiving a wafer container, a housing operably connected to the loadport, a wafer transfer mechanism for transferring a wafer between the wafer container and the housing, a wafer container sensor for detecting a presence of the wafer container on the loadport, a variable speed fan disposed in a first portion of the housing, a variable exhaust unit disposed in a second portion of the housing facing the first portion, the variable exhaust unit being capable of varying an exhaust rate of air from the housing, and a controller for variably operating the variable speed fan and the variable exhaust unit in response to a signal from the wafer container sensor.
