Patent 7441590 was granted and assigned to Denso on October, 2008 by the United States Patent and Trademark Office.
A radiator for a semiconductor includes a main body which is provided for radiating heat from the semiconductor mounted to a substrate, and a plate member attached to the main body. The plate member is provided to have an elasticity relative to the substrate. The plate member includes a plate portion that covers a part of one surface of the main body, opposite to the substrate, and four leg portions each of which extends from an outer periphery of the plate portion and is fixed to the substrate. In the radiator, the plate member effectively absorbs stress applied to the substrate.