Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 28, 2008
Patent Application Number
11463993
Date Filed
August 11, 2006
Patent Primary Examiner
Patent abstract
This invention provides a heat treatment jig for semiconductor silicon substrates, which, in respective heat treatment of hydrogen annealing or argon annealing, can handle enlargement of the diameter of wafers to be treated and can also prevent slipping and dislocations that occur as a result of the stress caused by the weight of the wafer itself or the deflection of the heat treatment jig itself.
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