US Patent 7443018 Integrated circuit package system including ribbon bond interconnect
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Patent Inventor Names
Christoph B. Luechinger0
Garrett L. Wong0
Kwang Yong Chung0
Mohd Helmy Bin Ahmad0
You Yang Ong0
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Patent abstract
An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.
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Official Website
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US Patent 07443018 Integrated circuit package system including ribbon bond interconnect US Patent 7443018 Integrated circuit package system including ribbon bond interconnect
Infobox
Patent Number
074430180
Patent Number
74430180
Edits on 26 Mar, 2023
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Infobox
Is a
Patent Jurisdiction
Patent Number
074430180
Date of Patent
October 28, 2008
0Patent Application Number
111640870
Date Filed
November 9, 2005
0Official Website
Patent Primary Examiner
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US Patent 07443018 Integrated circuit package system including ribbon bond interconnect
Infobox
Is a
Patent jurisdiction
Patent number
07443018
Date of patent
October 28, 2008
Patent application number
11164087
Date Filed
November 9, 2005
Patent primary examiner
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