Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Marvin Lo0
Date of Patent
October 28, 2008
0Patent Application Number
114225850
Date Filed
June 6, 2006
0Patent Primary Examiner
Patent abstract
A resulting solder bump structure comprising the following steps. A structure having a metal bond pad formed thereover is provided. A patterned cover layer is formed over the structure. The patterned cover layer including an opening exposing a portion of the metal bond pad. The patterned cover layer opening including side walls. A metal cap layer is formed over at least the exposed portion of the metal bond pad and the patterned cover layer side walls. A solder bump is formed over the metal cap layer.
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