Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Masaru Nakamura1
Date of Patent
November 4, 2008
1Patent Application Number
112366311
Date Filed
September 28, 2005
1Patent Primary Examiner
Patent abstract
A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed in a lattice pattern on the front surface, along the dividing lines, comprising the steps of:a tape affixing step for affixing a protective tape to one side of the wafer;a wafer holding step for holding the wafer affixed to the protective tape on both sides of each dividing line through the protective tape; anda breaking step for dividing the wafer along each dividing line by sucking, along each dividing line, the wafer held through the protective tape.
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