Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Uday Mahajan0
Liming Zhang0
Date of Patent
November 4, 2008
Patent Application Number
11031086
Date Filed
January 6, 2005
Patent Primary Examiner
Patent abstract
A selective polish for fabricating electronic devices is disclosed. The selective polish may include the use of a slurry that facilitates the selective polish of a first component but does not substantially polish a second component.
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