US Patent 7446409 Cavity-down multiple-chip package

A cavity-down multiple-chip package mainly includes a heat spreader, a circuit substrate with an opening, a chip, and at least one electronic element; wherein an upper surface of the circuit substrate defines at least one element mounting area; the heat spreader is disposed on said upper surface of the circuit substrate; and the element mounting area is exposed for disposing these electronic elements. A cavity is formed by the opening of the circuit substrate and the heat spreader and is used for accommodating the chip. A plurality of solder balls can be disposed on a lower surface of the circuit substrate.