Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Thomas A. Degenkolb0
Scott D. Brandenburg0
Shing Yeh0
Date of Patent
November 4, 2008
0Patent Application Number
117127180
Date Filed
March 1, 2007
0Patent Primary Examiner
Patent abstract
An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.
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