US Patent 7448275 Bi-planar process fluid pressure measurement system

A pressure measurement system includes a co-planar pressure sensor module coupled to a bi-planar pressure flange. The co-planar pressure sensor module has a pair of isolator diaphragms that are substantially co-planar with one another. A plurality of connection rings are welded proximate and about respective isolator diaphragms. A bi-planar pressure flange is welded to each of the connection rings. Fluidic coupling from a process fluid pressure inlet of the bi-planar flange to an isolator diaphragm of the co-planar pressure module occurs without encountering any compressive seals. A method of manufacturing a pressure measurement system is also provided.