Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
John S. Drewery0
Henner W. Meinhold0
Ismail T. Emesh0
Steven T. Mayer0
Jonathan D. Reid0
Mark L. Rea0
Date of Patent
November 11, 2008
0Patent Application Number
107398220
Date Filed
December 17, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A disclosed form of mechanically assisted electroplating leads to a flat, thin, overburden. In one example, an accelerator is deposited on a copper surface and mechanically removed in a simplified CMP-like apparatus. The wafer is then plated in an electrolyte containing little or no accelerating additives.
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