US Patent 7449512 Polyoxymethylene molding compounds

Thermoplastic molding compositions, comprisingA) from 15 to 99.94% by weight of a polyoxymethylene homo- or copolymerB) from 0.05 to 10% by weight of a nonpolar polypropylene wax,C) from 0.01 to 5% by weight of at least one ester or amide of saturated or unsaturated aliphatic carboxylic acids having from 10 to 40 carbon atoms with saturated aliphatic alcohols or amines having from 2 to 40 carbon atoms,D) from 0 to 80% by weight of other additives,where the total of the percentages by weight of components A) to D) is always 100%.