Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 18, 2008
Patent Application Number
11421284
Date Filed
May 31, 2006
Patent Primary Examiner
Patent abstract
According to one embodiment of the invention, a method of fabricating ball grid array packages includes providing a substrate, providing a ball film that includes a plurality of metal balls movably contained within respective slots of a thin film, coupling the metal balls to the substrate, and removing the thin film from the metal balls.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
