US Patent 7453150 Three-dimensional face-to-face integration assembly
Patent 7453150 was granted and assigned to Rensselaer Polytechnic Institute on November, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
John McDonald0
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Patent abstract
A via for connecting metallization layers of chips bonded in a face-to-face configuration is provided, as well as methods of fabricating the via. The via may function as an interconnection of metallization layers in three-dimensional, stacked, integrated circuits, and may enable high density, low-resistance interconnection formation.
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US Patent 07453150 Three-dimensional face-to-face integration assembly US Patent 7453150 Three-dimensional face-to-face integration assembly
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Patent Number
074531500
Patent Number
74531500
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Patent Jurisdiction
Patent Number
074531500
Date of Patent
November 18, 2008
0Patent Application Number
109019390
Date Filed
July 29, 2004
0Official Website
Patent Primary Examiner
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US Patent 07453150 Three-dimensional face-to-face integration assembly
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07453150
Date of patent
November 18, 2008
Patent application number
10901939
Date Filed
July 29, 2004
Patent primary examiner
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