US Patent 7453703 Electronic component module having electronic component with piezoelectric device
Patent 7453703 was granted and assigned to Renesas Technology Corp on November, 2008 by the United States Patent and Trademark Office.
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The present invention is to provide a small-sized electronic component module in which RF units of a mobile phone for multi-band and multi-system are integrated at low cost. In the RF module, an RF transceiver LSI, a SAW chip, and chip components are mounted on a module board. The SAW chip is mounted on the module board so that a cavity is formed between itself and the module board, and the SAW chip and other components such as the RF transceiver LSI and the chip components are adhered to the module board at their peripheral portions by a sheet-like sealing material, and they are directly covered with the sheet-like sealing material from outside thereof.
US Patent 07453703 Electronic component module having electronic component with piezoelectric device US Patent 7453703 Electronic component module having electronic component with piezoelectric device
US Patent 07453703 Electronic component module having electronic component with piezoelectric device
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