Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 25, 2008
Patent Application Number
11869708
Date Filed
October 9, 2007
Patent Primary Examiner
Patent abstract
A semiconductor device, including methods and arrangements for making the same, are described. The device includes an integrated circuit die having a plurality of bond pads. At least one bond pad on the active surface of the die is an extended I/O pad. Each extended I/O pad extends to at least one peripheral side edge of the die. Solder fillets are formed between the extended I/O pads and corresponding contacts on a substrate.
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