Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 25, 2008
Patent Application Number
11128311
Date Filed
May 13, 2005
Patent Primary Examiner
Patent abstract
Provided is a semiconductor laser diode package. The semiconductor laser diode package may include: a stem having a through hole formed at a predetermined position; a heat sink that may be disposed around the through hole and projects from one side of the stem; and a semiconductor laser diode mounted onto the heat sink.
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