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US Patent 7458833 Inseparable PCB module in a sub body of a device

Patent 7458833 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on December, 2008 by the United States Patent and Trademark Office.

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Patent abstract

Provided is an inseparable PCB module installed in a sub body of a device including a main body and the sub body performing predetermined opening and closing operations with respect to the main body. In the inseparable PCB module, a body part having a predetermined area, and a main body connecting part extending from the body part to a predetermined length and electrically connected to the main body are integrally formed, thereby reducing the entire volume and thickness of the device.

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