Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Daisuke Ueda0
Tetsuzo Ueda0
Date of Patent
December 2, 2008
0Patent Application Number
111460200
Date Filed
June 7, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention aims at providing a method for dividing a substrate that is capable of dividing each substrate into chips in the same square-like form without causing chip breaking and capable of forming all cleaved facets flat. In the method for dividing a substrate of the present invention, an electron beam 1 with the intensity that causes a dislocation inside the substrate is irradiated to a substrate surface 2 to generate a crack starting from such dislocation, and a cleaved facet 5 is formed to divide the substrate.
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