Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 9, 2008
Patent Application Number
11396963
Date Filed
April 3, 2006
Patent Primary Examiner
Patent abstract
A semiconductor device includes: a semiconductor substrate; an insulation layer which is disposed on the semiconductor substrate and includes a groove formed on a second surface of the insulation layer, opposite from a first surface of the insulation layer facing the semiconductor substrate; and a conductive part disposed on the insulation layer; wherein the conductive part has a wiring part formed in a manner that the wiring part comes in contact with a bottom surface and a side surface of the groove.
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