US Patent 7463491 Wiring board and a semiconductor device using the same

A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.