Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 16, 2008
Patent Application Number
11074417
Date Filed
March 8, 2005
Patent Primary Examiner
Patent abstract
A process, for patterning a thin film that is highly resistant to conventional etching processes and that is to be deposited at a high substrate temperature, is disclosed. The process uses a liftoff method wherein a refractory material has been substituted for the conventional organic resin. The method is particularly useful for the fabrication of tunable microwave devices and ferroelectric memory elements.
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