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US Patent 7465492 Electrically disbondable compositions and related methods

Patent 7465492 was granted and assigned to EIC LABORATORIES, INC. on December, 2008 by the United States Patent and Trademark Office.

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Patent abstract

Compositions capable of rapidly curing to a strong substrate bond are removable from a surface to which the composition is bonded without damage to the underlying substrates. The compositions of the present invention may be used in both temporary and permanent bonding and coating applications.

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