A resin injecting apparatus includes a resin injecting nozzle for injecting a molten resin into a cavity configured between a first resin molded part and a second resin molded part connected to the first molded part, from a through-hole configured in the second molded part, and an ejection plunger for ejecting a predetermined amount of molten resin from the resin injecting nozzle. In addition, a thermal insulating bush is attached to the resin injecting nozzle, a coolant passage is formed in the thermal insulating bush and through which a coolant is passed, and a coolant supplying unit supplies the coolant to the coolant passage.