Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Koichi Shigematsu0
Toshiyuki Yoshikawa0
Date of Patent
December 23, 2008
0Patent Application Number
113903390
Date Filed
March 28, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor wafer treatment method for dividing an adhesive tape, which has been stuck to the entire back of a semiconductor wafer, along divided streets of the semiconductor wafer. Before division of the adhesive tape by application of laser beams, the state of the divided streets is detected, and laser beams are applied to the adhesive tape based on such detection.
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