Patent attributes
A surface polishing method that polishes the surface of a hard brittle material, such as a glass substrate, an oxide film of a silicon wafer, and a ceramic substrate is disclosed. In the surface polishing method, a fixed abrasive grain polishing tool is used, in which the fixed abrasive grains are a porous substance of granule type in which many primary grains are partially bonded with each other with spaces among them without having the binder therein. The surface polishing method includes the steps of supplying loose abrasive grain slurry between the fixed abrasive grain polishing tool and a surface to be polished of an object, and dressing the top parts of the abrasive grains of the fixed abrasive grain polishing tool which parts contact the surface to be polished of the object by the supplied loose abrasive grains.
