Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 6, 2009
Patent Application Number
11379744
Date Filed
April 21, 2006
Patent Primary Examiner
Patent abstract
A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy layer and a plurality of conductive line structures is formed on the polyimide substrate. A second copper layer is formed over the polyimide substrate and the conductive line structures. A second lithographic and etching process is performed to pattern the second copper layer.
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