Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 6, 2009
Patent Application Number
11614426
Date Filed
December 21, 2006
Patent Primary Examiner
Patent abstract
A semiconductor device of an embodiment of the invention has a package substrate, and a semiconductor chip mounted on the package substrate. The semiconductor chip has an output section, and a filter section for decreasing the electromagnetic noise generated from the data communication path. The output section outputs a data signal into the data communication path, and has a buffer amplifier section for compensating the data signal.
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