Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tse-Hsine Laio0
Ting-Kuo Kao0
Date of Patent
January 6, 2009
Patent Application Number
11383185
Date Filed
May 12, 2006
Patent Primary Examiner
Patent abstract
In a printed circuit board and its heat dissipating metal surface layout, a layer of copper foil is coated onto the printed circuit board for dissipating heat, and the surface of the copper foil is covered by an insulating coating, and a bare copper is formed on the surface of copper foil which is not covered by the insulating coating, and the bare copper is arranged in a cross shape, or in the shape of “#”, so that when the printed circuit board goes through a soldering furnace, the cohesion of solder is even instead of aggregating at a same position or the center, so as to obtain a larger protruding area and facilitate dissipating heat and transmitting current.
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