US Patent 7476040 Compact optical sub-assembly with ceramic package

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Patent Citations Received

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US Patent 11768339 Optical receptacle and optical module

Edits on 17 Sep, 2023

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edited on 17 Sep, 2023

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Patent Inventor Names

Anand Shukla0

Chris Hart0

Craig A. Young0

David Peter Gaio0

Jeffrey Zack0

Mark J. Bailey0

Martin A. Helfand0

Philip Deane0

Wei Xu0

William K. Hogan0

Edits on 15 Sep, 2023

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Patent abstract

The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.

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edited on 21 May, 2023

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Official Website

https://pdfpiw.uspto.gov/.piw?Docid=074760400

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Golden AI

edited on 21 May, 2023