Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 13, 2009
Patent Application Number
10814175
Date Filed
April 1, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
Apparatus and method for metal electroplating. The apparatus for metal electroplating includes an electroplating tank for containing an electrolyte at a first temperature, a substrate holder for holding a semiconductor substrate, and a heater for heating the portion of the electrolyte adjacent to the substrate holder to a second temperature higher than the first temperature.
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