Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yoshihiro Kubota0
Kazuto Tsuji0
Sumikazu Hosoyamada0
Date of Patent
January 13, 2009
Patent Application Number
11078326
Date Filed
March 14, 2005
Patent Primary Examiner
Patent abstract
A semiconductor device includes: a semiconductor element; a circuit substrate having a cavity at a center thereof; a heat radiating member having the semiconductor element bonded at a central portion thereof; and a sealing resin configured to seal the semiconductor element in the cavity. A configuration is provided such that a bonding resin may be disposed in a gap portion which communicates with the cavity between the circuit substrate and the heat radiating member, and by means of a bonding force of the bonding resin, the heat radiating member is permanently fixed to the circuit substrate.
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